Hardcover bog
Vis udgåede udgivelser

Udgivelser med B Keser

29. marts 2019 – 4. januar 2022

Cover for B Keser · Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package - IEEE Press (Hardcover bog) (2022)

Embedded and Fan-Out Wafer and P... (2022)

Cover for B Keser · Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press (Hardcover bog) (2019)

Advances in Embedded and Fan-Out... (2019)