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Testing of Interposer-Based 2.5D Integrated Circuits 1st ed. 2017 edition
Ran Wang
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Testing of Interposer-Based 2.5D Integrated Circuits 1st ed. 2017 edition
Ran Wang
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p
| Medie | Bøger Hardcover bog (Bog med hård ryg og stift omslag) |
| Udgivet | 29. marts 2017 |
| ISBN13 | 9783319547138 |
| Forlag | Springer International Publishing AG |
| Antal sider | 182 |
| Mål | 453 g |
| Sprog | Tysk |
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